W94AD6KBHX5I

Brand	Winbond
Package	BGA
Quantity	2600
Date code	19 20 21 22+

SourcesChip

Unit A06, 7th Floor, East Wing, Building 4, SEG Technology Park, 3012 Huaqiang North Road, Lichun Community, Huaqiang North Subdistrict, Futian District, Shenzhen, Guangdong Province, China

Phone +86 185 6625 0904

Email rose@sourceschip.com

Teams teams

ECC / export diligence may apply.

Compliance review required for regulated classifications.